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Technical Capablities
  • Base laminates FR-2/ CEM-1/ FR-4 Copper Plating Thickness-18 microns/ 35 to 70 microns PCB thickness .2mm to 3.2mm
  • Minimum hole size-.25mm (finished)
  • Minimum gap between conductors-10mil
  • Minimum pitch of SMD-IC -20mil
  • Tolerance on hole diameter .15mm
  • Minimum SMD pin width 10mil.

Product Range